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Plated holes are designed along the module PCB edge.
Permanent, low-profile board-to-board connections without a separate connector.
Castellation is an interconnect method formed along the edge of a printed circuit board. Plated holes are positioned at the board perimeter and then routed through, leaving semicircular plated features—often called castellated holes, castellations, or castellated pads.
These exposed, solderable edges align with matching lands on a host PCB. During assembly, the module is placed on the host board and soldered in position. The resulting joints carry electrical signals or power while also helping secure the module mechanically.
Within ALMAX Keypads & Interfaces, Castellation belongs to the Interconnects group. It is a board-level connection method, not a complete keypad, circuit family, or electronics system by itself.
Permanent, low-profile board-to-board connections without a separate connector
This page focuses on Castellation as a solderable PCB-edge interconnect for mounting electronic modules directly to a host circuit board; related products and technologies are mentioned only where they help explain construction choices, integration, alternatives, or system fit.
A castellated module normally sits directly on a larger PCB or rigid electronic assembly. The connection is usually hidden inside the finished product, beneath an enclosure, control panel, keypad, display, or other user-facing interface.
The host board provides matching copper lands, routing, mechanical clearance, and access for assembly and inspection. The module may also need programming pads, test points, thermal clearance, or additional support depending on the design.
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Plated holes are designed along the module PCB edge.
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The board outline is routed through those holes, creating plated semicircular terminations.
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Each termination aligns with a corresponding solder land on the host PCB.
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Solder paste is deposited on the host board, and the module is positioned like a surface-mount component.
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Reflow creates solder joints that provide the intended electrical paths and help retain the module.
The finished result is a direct module-to-board connection with no separate mating connector. Its success depends on coordinated land geometry, board fabrication, surface finish, placement accuracy, solder volume, reflow conditions, and inspection criteria.
Standard edge castellations
Best for compact signal or low-power modules mounted along a straight board edge.
Multi-edge castellation
Used when connections or mechanical retention are needed on more than one side of the module.
Rigid PCB modules
Common where the module carries controllers, drivers, sensors, or communication electronics.
Rigid-flex module construction
Used when a soldered rigid section must transition into a flexible circuit or constrained assembly.
Reinforced layouts
May add suitable copper features, vias, or mechanical support where the application places greater stress on the soldered module.
Castellation with secondary support
Adhesive or underfill may be considered when the mechanical or environmental requirements justify added support.
Castellation is most relevant when the electronics can be treated as a permanent submodule. If regular removal, field replacement, or repeated mating is required, a separable connector may be more appropriate.
Benefits include:
Compact packaging
Removing a separate connector can reduce Z-height and free space inside the device.
Simplified sourcing
The connection function is built into the PCB edges and host-board lands rather than added as another mating component.
Production-ready modularity
A tested electronics function can be designed as a repeatable module for placement on a larger board.
Reliable permanent connection
Soldered joints avoid fretting at removable contact interfaces and suit applications that do not need frequent disconnection.
Efficient assembly
Properly designed modules can fit established pick-and-place and reflow processes.
Integrated development
ALMAX can coordinate the module, host-board interface, mechanical fit, test access, and surrounding HMI architecture as one product-specific solution.
Castellated modules are commonly based on rigid PCB materials such as FR-4. Rigid-flex constructions may use polyimide flex sections where the electronics must bend, route, or connect beyond the rigid module area.
Material and finish choices should be verified against soldering, storage, environmental, regulatory, and reliability requirements. Printed-silver PET circuits are not direct substitutes for solderable PCB castellations; soldered module edges require a construction compatible with the selected soldering process.
Long-term behavior depends on the complete design rather than the castellated feature alone. Key influences include PCB material, copper and plating quality, surface finish, pad geometry, solder-joint design, reflow control, module mass, host-board stiffness, operating temperature, vibration, shock, and exposure to moisture or chemicals.
Depending on the design, materials and reinforcement can be selected for improved resistance to thermal cycling and mechanical loading. Sealing or conformal protection may help in exposed environments, but the coating, enclosure, and cleaning process must remain compatible with the electrical and inspection requirements.
ALMAX can define prototype and production checks around the application, including dimensional inspection, continuity testing, functional testing, solder-joint review, and environmental or mechanical validation when required. Exact performance limits should be established through project-specific requirements and testing rather than assumed from the interconnect type.
These are adjacent options and system components, not all fully covered on this page. Use the dedicated page when the customer is specifically looking for another connection method, complete assembly, input, output, or electronics architecture.
If you are new to Castellation, think of it as a row of solderable half-holes along a PCB edge that lets an electronics module mount directly onto another circuit board. It is commonly used when a permanent, compact module connection is preferred over a separate connector. The most important things to consider are pad geometry, assembly process, mechanical loading, and test or service requirements.

Your questions, answered.
Castellation is used to mount a PCB module directly onto a host circuit board. The edge terminations carry electrical connections and contribute to the module's mechanical attachment.
Semicircular plated features on the module align with solder lands on the host PCB. Reflowed solder joins the two boards so the module functions like a surface-mount component.
Castellation creates a permanent soldered connection without a separate mating connector. A board-to-board connector is usually separable, which can help with servicing or replacement but adds components, mating height, and alignment requirements.
Yes. ALMAX can develop product-specific module geometry, connection count, pin assignment, host-board interface, electronics integration, mechanical fit, test access, and production requirements. The final scope depends on the customer's device and performance needs.
Rigid PCB materials such as FR-4 are common. Rigid-flex constructions may incorporate polyimide where a flexible section is needed. Copper plating, a solderable surface finish, solder mask, and compatible host-board lands form the connection system.
They can be considered for demanding products because the module is soldered rather than repeatedly mated. Suitability still depends on the full design, including shock, vibration, temperature cycling, moisture, chemicals, enclosure protection, materials, and validation testing.
Rework may be possible with suitable equipment and access, but Castellation is primarily intended as a permanent connection. If routine replacement is expected, a separable connector should be evaluated.
Useful inputs include the module function, schematic or pin requirements, host-board layout constraints, available space, module height, signal and power needs, environmental conditions, expected production process, test strategy, and service requirements.
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